JPH0440271Y2 - - Google Patents

Info

Publication number
JPH0440271Y2
JPH0440271Y2 JP1982150194U JP15019482U JPH0440271Y2 JP H0440271 Y2 JPH0440271 Y2 JP H0440271Y2 JP 1982150194 U JP1982150194 U JP 1982150194U JP 15019482 U JP15019482 U JP 15019482U JP H0440271 Y2 JPH0440271 Y2 JP H0440271Y2
Authority
JP
Japan
Prior art keywords
electrode
resistor
semiconductor substrate
insulating layer
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982150194U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5954960U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15019482U priority Critical patent/JPS5954960U/ja
Publication of JPS5954960U publication Critical patent/JPS5954960U/ja
Application granted granted Critical
Publication of JPH0440271Y2 publication Critical patent/JPH0440271Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
JP15019482U 1982-10-02 1982-10-02 半導体装置の電極構造 Granted JPS5954960U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15019482U JPS5954960U (ja) 1982-10-02 1982-10-02 半導体装置の電極構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15019482U JPS5954960U (ja) 1982-10-02 1982-10-02 半導体装置の電極構造

Publications (2)

Publication Number Publication Date
JPS5954960U JPS5954960U (ja) 1984-04-10
JPH0440271Y2 true JPH0440271Y2 (en]) 1992-09-21

Family

ID=30333188

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15019482U Granted JPS5954960U (ja) 1982-10-02 1982-10-02 半導体装置の電極構造

Country Status (1)

Country Link
JP (1) JPS5954960U (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5756211B2 (en]) * 1973-04-06 1982-11-29
JPS5233261U (en]) * 1975-08-29 1977-03-09
JPS53110465A (en) * 1977-03-09 1978-09-27 Nec Corp Semiconductor device

Also Published As

Publication number Publication date
JPS5954960U (ja) 1984-04-10

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